Hot Chips 2026: Arm details AGI server CPU with two 70-core N3P chiplets — touts 2 TB/s UCIe fabric link and 12-channel memory controller

Hot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per card — TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed die

Tom's Hardware | Aug 26, 2026 12:00 UTC